ABOUT US

        Guangdong ADA Semiconductor Equipment Ltd. was established in 2017, is a SRDI high-tech enterprise with the localization of wire bonder and advanced packaging equipment. Ada holds more than 130 patents, software and other intellectual property rights and breakthrough technologies in high-acceleration and high-precision motion control, high-precision optical recognition, software and hardware development, and mechanical structure design.Ada's Rocket series Wire bonder can achieve wire bonding cycle time within 40ms and bonding accuracy ±2μm, BPO≥35μm. Ada's Wire bonder have been widely in more than 300 packaging and testing companies.

Innovative technology

MicroLED mass transfer technology

Micro LED mass transfer refers to the transfer of tens of thousands of LED chips to the driving backplane and the realization of light-emitting function. Thin epitaxial layers are produced on the wafer through MOCVD.

Ball bonding technology

Ball Bonder is a high-speed automatic wire bonder. It uses thermal ultrasonic ball welding and wedge welding processes to conduct wire bonding on semiconductor devices by heating, pressurization and ultrasonic energy.

Panel-level/wafer-level packaging technology

Panel-level/wafer-level packaging is a scheme for converting from wafer and strip level to larger panel level, where large panel sizes and higher vehicle usage enable mass production of large packages.